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SMD Piezo Transducer

3v Smallest New Design SMD Piezo Transducer L9mm × W9mm × H1.9mm
Detailed Product Description

3v Smallest New Design SMD Piezo Transducer L9mm × W9mm × H1.9mm

Quick Detail:

  1. SMD Piezo Buzzer
  2. Size: L9mm*W9mm*H1.9mm
  3. SPL: Min.65dB at 4KHz/1.5Vp-p 1/2 Duty Square Wave/10cm
  4. RoHS and have strong R&D

Description:

  1. buzzer
  2. SMD Piezo Buzzer
  3. Piezo buzzer
  4. SMD Piezo Element

1. Technical Parameter

Measuring condition

Part shall be measured under a condition (Temperature: 5~35℃, Humidity: 45%~85%R.H., Atmospheric pressure: 860 ~1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ~1060hPa) is regulated to measure.

1Resonant Frequency4000±500Hz
2Operating Voltage1~20 Vp-p
3Rated CurrentMax.1mA ,at 4KHz 50% duty Square Wave 1.5Vp-p
4Sound Output at 10cmMin. 65dB,at 4KHz 50% duty Square Wave 1.5Vp-p
5Capacitance9000±30%pF at 1KHz
6Operating Temperature-30℃~+70℃
7Store Temperature-40℃~+85℃
8Net WeightApprox 0.2g
9RoHSYes
2. Dimensions Unit: mm



*Unit: mm; Tolerance: ±0.3mm Except Specified

*Housing Material: Black LCP

*Terminal plate: 2 soldering pads, tin Plating Brass

3.Electrical And Acoustical Measuring Condition

Recommended Setting



4.Frequency Response



5Vp-p 50% duty Square wave,10cm

5.Surface mounting condition

5.1 Reflow soldering

Recommendable reflow soldering condition is as follows.



Note: (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding

and pulling forces or shocks against the SMD sound transducers shall be kept minimum

to prevent them from electrical failures and mechanical damages of the devices.

(2) In the reflow soldering, too high soldering temperatures and too large temperature

Gradient such as rapid heating or cooling may cause electrical failures and mechanical

damages of the devices.

5.2 Soldering pattern