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SMD Piezo Transducer

10x3.2MM LCP SMD Piezo Buzzer / Sound Transducer 5V External Drive Type
Detailed Product Description
Resonant Frequency:4800±500HzSize:D10*H3.2mm
SPL:Min.75dB At 4.8KHz/5Vp-p 1/2 Duty Square Wave/10cmVoltage(VDC):1~20 Vp-p
Buzzer:Piezo BuzzerColour:Black
Housing Material:LCPProcessing:SMD

10x3.2MM LCP SMD Piezo Buzzer / Sound Transducer 5V External Drive Type

Quick Detail:

  1. SMD Piezo Buzzer
  2. Size: D10*H3.2mm
  3. SPL: Min.75dB at 4.8KHz/5Vp-p 1/2 Duty Square Wave/10cm
  4. RoHS and have strong R&D

Description:

  1. buzzer
  2. SMD Piezo Buzzer
  3. SMD Piezo Element
  4. 5V Buzzer
  5. 10mm SMD Piezo Buzzer

1. Technical Parameter

Measuring condition

Part shall be measured under a condition (Temperature: 5~35℃, Humidity: 45%~85%R.H., Atmospheric pressure: 860 ~1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ~1060hPa) is regulated to measure.

1

Resonant Frequency

4800±500Hz

2

Operating Voltage

1~20 Vp-p

3

Rated Current

Max.1mA ,at 4.8KHz 50% duty Square Wave 5Vp-p

4

Sound Output at 10cm

Min. 75dB,at 4.8KHz 50% duty Square Wave 5Vp-p

5

Capacitance

10000±30%pF at 1KHz

6

Operating Temperature

-20℃~+70℃

7

Store Temperature

-30℃~+80℃

8

Net Weight

Approx 0.5g

9

RoHS

Yes

2. Dimensions Unit: mm



*Unit: mm; Tolerance: ±0.3mm Except Specified

*Housing Material: Black LCP

*Terminal plate: 2 soldering pads, DuAu

3.Electrical And Acoustical Measuring Condition

Recommended Setting



Surface mounting condition

Reflow soldering

Recommendable reflow soldering condition is as follows.



Note:

  1. In automated mounting of the SMD sound transducers on PCB, any bending, expanding and pulling forces or shocks against the SMD sound transducers shall be kept minimum to prevent them from electrical failures and mechanical damages of the devices.
  2. In the reflow soldering, too high soldering temperatures and too large temperature Gradient such as rapid heating or cooling may cause electrical failures and mechanical damages of the devices.